Allied Prep Tools
Multiprep Polishing System
The multiprep is a semi-automatic polishing system that can be used to prepare a wide variety of microscopy samples. These include SEM, EBSD, TEM, AFM and optical profiler specimens. The polishing system can be used with silicon carbide, diamond lapping film or colloidal silica and alumina.
The M-prep 3 uses the same polishing substrates as the Multiprep but lacks the automated features.
The Techcut 4 is a low speed saw for sectioning of smaller samples from larger bulk materials. Gravity feed cutting system allows for counterbalancing of delicate samples. The instrument also features an automatic lubrication system.
Gatan Prep Tools
Tuned Piezo Cutting Tool
This tool is used for cutting a 3 mm diameter disc, with a maximum thickness of 5 mm, from bulk material for TEM sample preparation.
Precision Etching Coating System (PECS)
This tool adds a thin conductive layer of gold/palladium, carbon, chromium or platinum to SEM samples to reduce charging.
Precision Ion Polishing System (PIPS)
The ion etching system is intended for the final phase of polishing for TEM samples. The system uses Argon gas to remove surface material to a thickness of 30 to 100 nm.
SEM Mill Model 1060
The SEM mill is a polishing system to that uses Argon gas to remove surface material to achieve a smooth surface for use in a SEM or TEM applications.
Dimpler Model D500i
The Dimpler is used to reduce the thickness of samples in TEM preparation. It uses a variety of dimpling tools to grind a 3 mm diameter disk to a maximum point thickness of approximately 75 µm and minimum point thickness of 5-10 µm.